CARRIER STRUCTURE, CELL CONTACTING SYSTEM AND MANUFACTURING METHOD

To provide a carrier structure that insulates safely and reliably between electrically conductive parts even at high temperatures and is able to be manufactured inexpensively and compactly, a cell contacting system having the same, and a manufacturing method.SOLUTION: The present invention relates t...

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Bibliographic Details
Main Authors MANUEL EHEIM, JONAS ROLAND HAPP, ANDRE MARTIN DRESSEL, RUDI BLUMENSCHEIN, MATTHIAS BECK, FRANK KAEHNY
Format Patent
LanguageEnglish
Japanese
Published 14.01.2021
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Summary:To provide a carrier structure that insulates safely and reliably between electrically conductive parts even at high temperatures and is able to be manufactured inexpensively and compactly, a cell contacting system having the same, and a manufacturing method.SOLUTION: The present invention relates to carrier structures which can be used for electrical contacting of batteries e.g. in motor vehicles. A carrier structure (100) for electrically insulating at least one first electrically conductive part from at least one second electrically conductive part comprises an electrically insulating base body (102), which has a first holding structure for holding the first electrically conductive part (104) and a second holding structure for holding the second electrically conductive part (106), and an electrically insulating spacer (110), which is embedded in at least part of a separation region (108) between the first and second electrically conductive parts, in which the spacer (110) has an intumescent material and/or an inorganic high temperature-resistant filler.SELECTED DRAWING: Figure 1 【課題】高温でも導電性部品間を安全かつ確実に絶縁し、安価で小型に製造可能なキャリア構造、それを有するセル接触システム、および製造方法の提供。【解決手段】本発明は、例えば自動車のバッテリの電気接触に使用可能なキャリア構造に関する。少なくとも1つの第1の導電性部品と少なくとも1つの第2の導電性部品とを電気的に絶縁するためのキャリア構造(100)は、第1の導電性部品(104)を保持するための第1の保持構造および第2の導電性部品(106)を保持するための第2の保持構造を有する電気絶縁ベース本体(102)と、第1の導電性部品と第2の導電性部品との間の分離領域(108)の少なくとも一部に埋め込まれている電気絶縁スペーサ(110)とを備え、スペーサ(110)は膨張材料および/または無機高温耐熱フィラーを有する。【選択図】図1
Bibliography:Application Number: JP20200105716