JOINING METHOD AND JOINING DEVICE

• Main Authors: TAKIZAWA HIROTANE, FURUSAWA AKIO, TAZAKI MANABU, HAYASHI YAMATO
• Format: Patent
• Language: English; Japanese
• Published: 07.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASTING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; POWDER METALLURGY; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING METALLIC POWDER

To provide a new method for joining objects together using metal nanoparticle paste.SOLUTION: A method of joining two objects together using metal nanoparticle paste includes a step (1) of applying paste (12) to one object (10), a step (2) of placing the other object (11) on the paste and positioning the paste with the objects separated by a predetermined distance, a step (3) of heating the objects and the paste between the objects while maintaining the separated state until the paste viscosity decreases to a predetermined value, a first pressurizing step (4) of heating the objects and the paste between the objects to a predetermined temperature at which metal nanoparticles can be sintered and/or melt-bonded while applying predetermined first pressure to between the objects and a second pressurizing step (5) of applying predetermined second pressure larger than the first pressure to between the objects.SELECTED DRAWING: Figure 1 【課題】 金属ナノ粒子ペーストを用いて対象物を接合する新たな方法を提供する。【解決手段】金属ナノ粒子ペーストを用いて、２つの対象物を接合する方法は、（１）一方の対象物（１０）にペースト（１２）を塗布する工程、（２）他方の対象物（１１）をペースト上に配置し、対象物が所定距離で離間した状態でペーストを位置させる工程、（３）離間した状態を維持して対象物およびその間のペーストをペースト粘度が所定値に低下するまで加熱する工程、（４）所定の第１圧力を対象物間に加えながら、対象物およびその間のペーストを金属ナノ粒子の焼結接合および／または溶融接合が可能な所定温度まで加熱する第１加圧工程、ならびに（５）第１圧力より大きい所定の第２圧力を対象物間に加える第２加圧工程を含んで成る。【選択図】 図１