SUBSTRATE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

To provide a substrate for semiconductor device and manufacturing method for semiconductor device using the same, capable of preventing generation of a lag or drop-off of a metal part which becomes a lead or a die pad.SOLUTION: On a mother die 20, a metal part which becomes a lead 3 and/or a die pad...

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Bibliographic Details
Main Authors GOROMARU YUYA, KOGA TATSUYA, HAYASHIDA MASAYUKI
Format Patent
LanguageEnglish
Japanese
Published 24.12.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a substrate for semiconductor device and manufacturing method for semiconductor device using the same, capable of preventing generation of a lag or drop-off of a metal part which becomes a lead or a die pad.SOLUTION: On a mother die 20, a metal part which becomes a lead 3 and/or a die pad 4 is formed. The mother die 20 includes a first base material 20a and a second base material 20b to be formed with a metal part. The first base material 20a is formed on the second base material 20b by plating. The mother die 20 is structured to be separated between the first base material 20a and the second base material 20b.SELECTED DRAWING: Figure 1 【課題】リードやダイパッドとなる金属部のズレやヌケの発生を防止できる半導体装置用基板、並びに該半導体装置用基板を用いた半導体装置の製造方法を提供する。【解決手段】母型２０上に、リード３および／またはダイパッド４となる金属部が形成されている。母型２０は、金属部が形成される第１基材２０ａと第２基材２０ｂとを含んでいる。第１基材２０ａは、第２基材２０ｂ上にめっきにより形成されている。母型２０は、第１基材２０ａと第２基材２０ｂとの間で分離可能な構成となっている。【選択図】図１
Bibliography:Application Number: JP20200156856