CIRCUIT STRUCTURE AND ELECTRICAL JUNCTION BOX

To provide a technique capable of bringing a circuit board and a heat radiating member close to each other.SOLUTION: A circuit structure 20 includes a circuit board 30, a heat radiating member 50 stacked on the circuit board 30, and an insulating sheet 60 provided between the circuit board 30 and th...

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Bibliographic Details
Main Author KITA YUKINORI
Format Patent
LanguageEnglish
Japanese
Published 17.12.2020
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Summary:To provide a technique capable of bringing a circuit board and a heat radiating member close to each other.SOLUTION: A circuit structure 20 includes a circuit board 30, a heat radiating member 50 stacked on the circuit board 30, and an insulating sheet 60 provided between the circuit board 30 and the heat radiating member 50.SELECTED DRAWING: Figure 1 【課題】回路基板と放熱部材とを近づけることができる技術を提供することを目的とする。【解決手段】回路構成体20は、回路基板30と、前記回路基板30に重ねられる放熱部材50と、前記回路基板30と前記放熱部材50との間に設けられる絶縁シート60と、を備える。【選択図】図1
Bibliography:Application Number: JP20190105903