VAPOR CHAMBER, ELECTRONIC APPARATUS AND METAL SHEET FOR VAPOR CHAMBER

• Main Authors: TAKEMATSU KIYOTAKA, ODA KAZUNORI, OTA TAKAYUKI, TAKEDA TOSHIHIKO, TAKAHASHI SHINICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 17.12.2020
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; WEAPONS

To provide a vapor chamber that can be enhanced in heat transport capacity.SOLUTION: A vapor chamber according to the present invention has, in a second flow passage, a main flow groove extending in a first direction, a main flow projection part array adjoining the main flow groove, and a split flow projection part array provided on an outer edge side, extending in the first direction, of the second flow passage. The main flow projection part array consists of a plurality of main flow projection parts arrayed in the first direction, and main flow connection grooves are provided between the plurality of main flow projection parts. The split flow projection part array consists of a plurality of split flow projection parts arrayed in the first direction, and split-flow connection grooves are provided between the plurality of split flow projection parts, the number of the split flow connection grooves being larger than the number of the main flow connection grooves.SELECTED DRAWING: Figure 4 【課題】 熱輸送能力を高めることができるベーパーチャンバを提供する。【解決手段】 本発明によるベーパーチャンバは、第２流路に、第１方向に延びる主流溝と、主流溝に隣接する主流凸部列と、第２流路の第１方向に延びる外縁側に設けられた分流凸部列と、を有し、主流凸部列は、第１方向に配列された複数の主流凸部から構成され、複数の主流凸部の間に、主流連絡溝が設けられており、分流凸部列は、第１方向に配列された複数の分流凸部から構成され、複数の分流凸部の間に、分流連絡溝が設けられており、分流連絡溝の数が主流連絡溝の数より多い構成を有している。【選択図】 図４