DAMPER DEVICE

To provide a damper device which enables electric connection with the outside without pulling out a lead wire for a motor and a lead wire for a heater from a body of the damper device to the outside.SOLUTION: A damper device includes: a frame 3 which supports a baffle 2 in such a way so as to enable...

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Bibliographic Details
Main Author SAITO SHUNJI
Format Patent
LanguageEnglish
Japanese
Published 03.12.2020
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Summary:To provide a damper device which enables electric connection with the outside without pulling out a lead wire for a motor and a lead wire for a heater from a body of the damper device to the outside.SOLUTION: A damper device includes: a frame 3 which supports a baffle 2 in such a way so as to enable driving for opening/closing; a drive part case 4 which is coupled to the frame 3 and houses a motor serving as a drive part of the baffle 2; a substrate 7 electrically connecting a connector terminal 8, which electrically connects with the outside, with the motor and attached to the frame 3; a first positioning part 62 comprising first protruding parts 58, 59, which are included in the frame 3, and first recessed parts, which are included in the drive part case 4 and receive the first protruding parts during coupling, in a manner that each protruding part and each recessed part make a pair; and a second positioning part 68 comprising second protruding parts 64, which are included in a terminal holder of the motor, and second recessed parts 66, 67, which are included in the substrate and receive the second protruding parts during the coupling, in a manner that each protruding part and each recessed part make a pair.SELECTED DRAWING: Figure 13 【課題】モーター用リード線やヒーター用リード線をダンパ装置の本体から外部に引き出すことなく外部との電気的接続を可能なダンパ装置を提供する。【解決手段】ダンパ装置は、バッフル2を開閉駆動可能に支持するフレーム3と、フレーム3と結合され、バッフル2の駆動部としてのモーターを収納する駆動部ケース4と、外部との電気的接続を行うコネクタ端子8とモーターとを電気的に接続し、フレーム3に取り付けられる基板7と、フレーム3が備える第1凸部58、59と、駆動部ケース4が備え前記結合の際に第1凸部を受け入れる第1凹部との対で構成される第1位置決め部62と、モーターの端子ホルダが備える第2凸部64と、基板が備え前記結合の際に第2凸部を受け入れる第2凹部66、67との対で構成される第2位置決め部68と、を備える。【選択図】図13
Bibliography:Application Number: JP20190097719