COMPONENT MOUNTING SYSTEM

• Main Authors: YAMAMOTO KUNIO, OGURA KANKI, MATSUO SEIICHI
• Format: Patent
• Language: English; Japanese
• Published: 19.11.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a component mounting system capable of simultaneously detecting the presence/absence of an electronic component at the tip of the nozzle and an object on the top of the board without interfering with the mounting work of the electronic component.SOLUTION: A component mounting system 1 has, on a mounting head 11, a head camera 15 capable of simultaneously picking up an image of the tip of a nozzle 11b and the top surface of a board 3. The component mounting system 1 is configured to mount an electronic component D onto the board 3 by moving a mounting head 11 which has at least one nozzle 11b for holding the electronic component D between a component supply unit 4 that supplies the electronic component D and a board holding unit 2a that holds the board 3.SELECTED DRAWING: Figure 2 【課題】電子部品の搭載作業を阻害することなくノズルの先端の電子部品の有無と基板の上面にある物を同時に検出することができる部品実装装置を提供する。【解決手段】部品実装装置１は、搭載ヘッド１１にノズル１１ｂの先端と基板３の上面とを同時に撮像可能なヘッドカメラ１５を有している。部品実装装置１は、電子部品Ｄを供給する部品供給部４と基板３を保持する基板保持部２ａとの間で電子部品Ｄを保持する少なくとも一つのノズル１１ｂを有する搭載ヘッド１１を移動させて電子部品Ｄを基板３に搭載する。【選択図】図２