CONNECTION STRUCTURE, MANUFACTURING METHOD THEREOF, CONNECTION MATERIAL, AND COATED CONDUCTIVE PARTICLES

• Main Authors: TANAKA YUSUKE, SUGIOKA SAORI, KUGA IKUKO, AOKI MASAHARU, NAMIKI HIDEJI
• Format: Patent
• Language: English; Japanese
• Published: 12.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONDUCTORS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES

To provide a connection structure, a manufacturing method thereof, a connection material, and coated conductive particles capable of lowering and stabilizing a conduction resistance value.SOLUTION: A connection structure includes a first electronic component 1 having a first terminal 1a, a second electronic component 2 having a second terminal 2a, and a cured film in which a connecting material is cured between the first electronic component 1 and the second electronic component 2, and in coated conductive particles 3 between the first terminal 1a and the second terminal 2a, metal atoms of a conductive layer are dispersed in metal of metal fine particles, and the metal of the first terminal and the metal atoms of the second terminal are diffused into the metal of the metal fine particles.SELECTED DRAWING: Figure 1 【課題】導通抵抗値の低抵抗化及び安定化を図ることができる接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子を提供する。【解決手段】接続構造体は、第１の端子１ａを有する第１の電子部品１と、第２の端子２ａを有する第２の電子部品２と、第１の電子部品１と第２の電子部品２との間に、前述の接続材料が硬化した硬化膜とを備え、第１の端子１ａと第２の端子２ａとの間の被覆導電粒子３は、導電層の金属原子が、金属微粒子の金属中に拡散してなるとともに、第１の端子の金属及び第２の端子の金属原子が、金属微粒子の金属中に拡散してなる。【選択図】図１