ELASTIC WAVE DEVICE, MANUFACTURING METHOD THEREOF, FILTER, AND MULTIPLEXER

• Main Authors: IWABUCHI RYOTA, MIYAGAWA TAKU, KIKUCHI TSUTOMU, YAMAUCHI MOTOI, HATAYAMA KAZUE, HAMANO MITSUHIKO
• Format: Patent
• Language: English; Japanese
• Published: 05.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

To suppress deterioration due to thermal stress.SOLUTION: An elastic wave device includes a first substrate having a first surface, a second substrate mounted on the first substrate such that a second surface faces the first surface through a gap, an annular metal layer provided on the first surface so as to surround the second substrate, an annular insulating layer provided on the annular metal layer in a region on the center side of the first substrate, an elastic wave element provided on at least one of the first surface and the second surface, and a sealing solder layer that surrounds the second substrate, seals the elastic wave element in the gap, joins with the surface of the annular metal layer not provided with the annular insulating layer, and does not join with the annular insulating layer.SELECTED DRAWING: Figure 1 【課題】熱応力に起因した劣化を抑制すること。【解決手段】第１面を有する第１基板と、前記第１基板上に、前記第１面に空隙を介し第２面が向き合うように搭載された第２基板と、前記第１面に前記第２基板を囲むように設けられた環状金属層と、前記環状金属層上のうち前記第１基板の中心側の領域に設けられた環状絶縁層と、前記第１面および前記第２面の少なくとも一方に設けられた弾性波素子と、前記第２基板を囲み、前記弾性波素子を前記空隙に封止し、前記環状絶縁層が設けられていない前記環状金属層の表面と接合し、前記環状絶縁層と接合していない封止半田層と、を備える弾性波デバイス。【選択図】図１