METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

• Main Authors: TANABE YUTO, KATO MASAHIRO, SHINADA EIITSU
• Format: Patent
• Language: English; Japanese
• Published: 05.11.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a high-density multilayer wiring board having excellent connection reliability and minute junction terminal pitches.SOLUTION: A method for manufacturing a multilayer wiring board includes: a printed wiring board manufacturing step (I) of preparing a plurality of printed wiring boards having both electrical connection pads and non-connection pads on the same plane; and a lamination step (II) of overlaying the printed wiring boards so that the electrical connection pads face each other, and laminating the printed wiring boards so that the printed wiring boards are bonded to each other through a conductive paste provided between the facing electrical connection pads. In the printed wiring board manufacturing step (I), an insulating film is attached to at least one of surfaces faced when the printed wiring boards are overlaid in the lamination step (II) (Ia), holes are bored in the insulating film so that the electrical connection pads are exposed (Ib), and a conductive paste is provided in the holes formed in the insulating film by the hole-boring (Ic).SELECTED DRAWING: Figure 1 【課題】接続信頼性に優れた、微小な接合端子ピッチを備えた高密度多層配線板を提供する。【解決手段】電気的接続パッドと非接続パッドとの両方を同一面内に備える複数枚のプリント配線板を準備するプリント配線板製造工程（Ｉ）と、複数枚のプリント配線板を電気的接続パッド同士が対向するように重ね、対向する電気的接続パッド同士の間に配置した導電性ペーストにより接合するように積層する積層工程（ＩＩ）とを有する多層配線板の製造方法である。プリント配線板製造工程（Ｉ）では、積層工程（ＩＩ）で複数枚のプリント配線板を重ねる際に対向させる面の少なくとも一方の面に絶縁フィルムを貼り付け（Ｉａ）、電気的接続パッドが露出するように、絶縁フィルムに対して穴明けを行い（Ｉｂ）、この穴明けによって絶縁フィルムに形成された穴に導電性ペーストを配置する（Ｉｃ）。【選択図】図１