SUBSTRATE, COMPONENT MOUNTING SUBSTRATE, ELECTRIC CONNECTION BOX AND METHOD FOR MANUFACTURING SUBSTRATE

To suppress soldering failure.SOLUTION: A substrate 30 includes a plurality of plate-like bus bars 31, and a resin part 40 which is brought into contact with the plurality of bus bars 31 and fixes a relative position of the plurality of bus bars 31, in which the resin part 40 includes a first openin...

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Bibliographic Details
Main Authors AKIMOTO NAOYA, OGA YUYA
Format Patent
LanguageEnglish
Japanese
Published 05.11.2020
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Summary:To suppress soldering failure.SOLUTION: A substrate 30 includes a plurality of plate-like bus bars 31, and a resin part 40 which is brought into contact with the plurality of bus bars 31 and fixes a relative position of the plurality of bus bars 31, in which the resin part 40 includes a first opening 41 exposing one plate surface of the bus bars 31 and a second opening 42 exposing a plate surface opposite to one of the bus bars 31, the bus bar 31 includes a soldering part 33 that has a terminal insertion hole 34 capable of inserting a terminal 23 therethrough and can solder the terminal 23, a first exposure part 37 exposed from the first opening 41, a second exposure part 38 exposed from the second opening 42, and a cutting part 36A cutting a tie bar 36 connecting the plurality of adjacent bus bars 31 in a region in the first opening 41 and the second opening 42, and the first exposure part 37 has an area of the exposed plate surface larger than that of the second exposure part 38.SELECTED DRAWING: Figure 9 【課題】半田付け不良を抑制する。【解決手段】基板30は、板状の複数のバスバー31と、複数のバスバー31に密着して複数のバスバー31の相対的位置が固定される樹脂部40と、を備える基板30であって、樹脂部40は、バスバー31の一方の板面を露出させる第1開口部41と、バスバー31の一方とは反対側の板面を露出させる第2開口部42と、を備え、バスバー31は、端子23を挿通可能な端子挿通孔34を有して端子23を半田付け可能な半田付け部33と、第1開口部41から露出する第1露出部37と、第2開口部42から露出する第2露出部38と、第1開口部41及び第2開口部42内の領域で隣り合う複数のバスバー31間を連結するタイバー36が切断された切断部36Aと、を備え、第1露出部37は、第2露出部38よりも露出する板面の面積が大きくされている。【選択図】図9
Bibliography:Application Number: JP20190085234