SEMICONDUCTOR LASER MODULE

• Main Authors: TSUKIJI NAOKI, EMORI YOSHIHIRO, TOMIYASU TAKAHIRO, ISHII HIROTATSU
• Format: Patent
• Language: English; Japanese
• Published: 05.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS

To provide a semiconductor laser module capable of suppressing a decrease in optical coupling efficiency, manufacturability, connectivity, and handling properties.SOLUTION: A semiconductor laser module comprises: an optical fiber 120 having a core part 121a and a cladding part 121b formed on an outer periphery of the core part; a semiconductor laser device 115 outputting a laser beam in a multimode; and a coupling optical system coupling the laser beam to an end face of the optical fiber. The optical fiber includes: a first fixed diameter part 121 a core diameter of which is nearly constant in a lengthwise direction; and a first tapered part 122 that is positioned closer to an end face side than the first fixed diameter part and has such a tapered shape as to decrease in a sectional area of the core part from the end face side toward the first fixed diameter part in the lengthwise direction. An area of the core part at the end face is larger than the sectional area of the core part at the first fixed diameter part.SELECTED DRAWING: Figure 2 【課題】光結合効率、製造性、接続性および取り扱い性の低下を抑制できる半導体レーザモジュールを提供すること。【解決手段】半導体レーザモジュールは、コア部１２１ａと、コア部の外周に形成されたクラッド部１２１ｂとを有する光ファイバ１２０と、レーザ光をマルチモードで出力する半導体レーザ素子１１５と、レーザ光を光ファイバの端面に結合させる結合光学系と、を備え、光ファイバは、長手方向においてコア径が略一定の第１定径部１２１と、第１定径部よりも端面の側に位置し、長手方向において端面の側から第１定径部に向かってコア部の断面積が縮小するテーパ形状を有する第１テーパ部１２２とを備え、端面におけるコア部の面積が第１定径部におけるコア部の断面積よりも大きい。【選択図】図２