WIRING BOARD AND WIRING BOARD WITH COMPONENT
To provide a wiring board capable of reducing variation in the height of connections.SOLUTION: In a wiring board 10 comprising a support substrate 1, wiring layers 3(A), 3(B) formed on one surface side thereof, and having multiple wiring including pad parts PA1 to PB2, and a cover insulation layer 4...
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Format | Patent |
Language | English Japanese |
Published |
08.10.2020
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Abstract | To provide a wiring board capable of reducing variation in the height of connections.SOLUTION: In a wiring board 10 comprising a support substrate 1, wiring layers 3(A), 3(B) formed on one surface side thereof, and having multiple wiring including pad parts PA1 to PB2, and a cover insulation layer 4 covering the wiring layers and having openings X at positions corresponding to the pad parts, the wiring board has component mounting regions M for mounting components, has at least the inner pad parts PA1, PB1, as pad parts, in the component mounting regions, and the area of the inner pad parts exposed by the openings X is 2.0×10-3 mm2 or less. The wiring layer has wiring A and wiring B, total area of the pad part PB1, exposed in the wiring B, is larger than the exposed total area in the wiring A, and the ratio (SB/SA) of the total area SB in the wiring B to the total area SA in the wiring A is 103-106.SELECTED DRAWING: Figure 3
【課題】接続部の高さのバラつきを小さくできる配線基板を提供する。【解決手段】支持基板1と、その一方の面側に形成され、パッド部PA1〜PB2を含む複数の配線を有する配線層3(A)、3(B)と、配線層を覆い、パッド部に対応する位置に開口部Xを有するカバー絶縁層4と、を備える配線基板10であって、配線基板は、素子を実装するための素子実装領域Mを有し、パッド部として、素子実装領域内に内部パッド部PA1、PB1を少なくとも有し、開口部Xにより露出した内部パッド部の面積は、2.0×10−3mm2以下である。配線層は、配線Aおよび配線Bを有し、配線Bにおいて露出したパッド部PB1の総面積が、配線Aにおける露出総面積よりも大きく、配線Aにおける総面積SAに対する上記配線Bにおける上記総面積SBの割合(SB/SA)が、103以上、106以下である。【選択図】図3 |
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AbstractList | To provide a wiring board capable of reducing variation in the height of connections.SOLUTION: In a wiring board 10 comprising a support substrate 1, wiring layers 3(A), 3(B) formed on one surface side thereof, and having multiple wiring including pad parts PA1 to PB2, and a cover insulation layer 4 covering the wiring layers and having openings X at positions corresponding to the pad parts, the wiring board has component mounting regions M for mounting components, has at least the inner pad parts PA1, PB1, as pad parts, in the component mounting regions, and the area of the inner pad parts exposed by the openings X is 2.0×10-3 mm2 or less. The wiring layer has wiring A and wiring B, total area of the pad part PB1, exposed in the wiring B, is larger than the exposed total area in the wiring A, and the ratio (SB/SA) of the total area SB in the wiring B to the total area SA in the wiring A is 103-106.SELECTED DRAWING: Figure 3
【課題】接続部の高さのバラつきを小さくできる配線基板を提供する。【解決手段】支持基板1と、その一方の面側に形成され、パッド部PA1〜PB2を含む複数の配線を有する配線層3(A)、3(B)と、配線層を覆い、パッド部に対応する位置に開口部Xを有するカバー絶縁層4と、を備える配線基板10であって、配線基板は、素子を実装するための素子実装領域Mを有し、パッド部として、素子実装領域内に内部パッド部PA1、PB1を少なくとも有し、開口部Xにより露出した内部パッド部の面積は、2.0×10−3mm2以下である。配線層は、配線Aおよび配線Bを有し、配線Bにおいて露出したパッド部PB1の総面積が、配線Aにおける露出総面積よりも大きく、配線Aにおける総面積SAに対する上記配線Bにおける上記総面積SBの割合(SB/SA)が、103以上、106以下である。【選択図】図3 |
Author | FURUSHO HIROKI SAKAKI MASASHI NARITA YUJI |
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DocumentTitleAlternate | 配線基板および素子付配線基板 |
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RelatedCompanies | DAINIPPON PRINTING CO LTD |
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Snippet | To provide a wiring board capable of reducing variation in the height of connections.SOLUTION: In a wiring board 10 comprising a support substrate 1, wiring... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | WIRING BOARD AND WIRING BOARD WITH COMPONENT |
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