WIRING BOARD AND WIRING BOARD WITH COMPONENT

• Main Authors: SAKAKI MASASHI, NARITA YUJI, FURUSHO HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 08.10.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a wiring board capable of reducing variation in the height of connections.SOLUTION: In a wiring board 10 comprising a support substrate 1, wiring layers 3(A), 3(B) formed on one surface side thereof, and having multiple wiring including pad parts PA1 to PB2, and a cover insulation layer 4 covering the wiring layers and having openings X at positions corresponding to the pad parts, the wiring board has component mounting regions M for mounting components, has at least the inner pad parts PA1, PB1, as pad parts, in the component mounting regions, and the area of the inner pad parts exposed by the openings X is 2.0×10-3 mm2 or less. The wiring layer has wiring A and wiring B, total area of the pad part PB1, exposed in the wiring B, is larger than the exposed total area in the wiring A, and the ratio (SB/SA) of the total area SB in the wiring B to the total area SA in the wiring A is 103-106.SELECTED DRAWING: Figure 3 【課題】接続部の高さのバラつきを小さくできる配線基板を提供する。【解決手段】支持基板１と、その一方の面側に形成され、パッド部ＰＡ１〜ＰＢ２を含む複数の配線を有する配線層３（Ａ）、３（Ｂ）と、配線層を覆い、パッド部に対応する位置に開口部Ｘを有するカバー絶縁層４と、を備える配線基板１０であって、配線基板は、素子を実装するための素子実装領域Ｍを有し、パッド部として、素子実装領域内に内部パッド部ＰＡ１、ＰＢ１を少なくとも有し、開口部Ｘにより露出した内部パッド部の面積は、２．０×１０−３ｍｍ２以下である。配線層は、配線Ａおよび配線Ｂを有し、配線Ｂにおいて露出したパッド部ＰＢ１の総面積が、配線Ａにおける露出総面積よりも大きく、配線Ａにおける総面積ＳＡに対する上記配線Ｂにおける上記総面積ＳＢの割合（ＳＢ／ＳＡ）が、１０３以上、１０６以下である。【選択図】図３