PRINTED WIRING BOARD AND POWER CONVERSION DEVICE

To provide a printed wiring board and a power conversion device for simplifying an addition of a connecting member and a process and suppressing an increase in parasitic inductance of wiring.SOLUTION: A printed wiring board includes: a substrate having a core material and an insulating prepreg forme...

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Main Authors TAKAHASHI HIROAKI, SAITO HIROYUKI, MIYANAGA TAKUYA, MATSUOKA SHOGO, KITAMURA YASUHIKO, WATANABE TOSHIO, YOTSUMOTO SHINICHIRO, IWASHITA SHO, KISHIWADA YU
Format Patent
LanguageEnglish
Japanese
Published 08.10.2020
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Summary:To provide a printed wiring board and a power conversion device for simplifying an addition of a connecting member and a process and suppressing an increase in parasitic inductance of wiring.SOLUTION: A printed wiring board includes: a substrate having a core material and an insulating prepreg formed on a surface of the core material; and an inner layer pattern having a conductive connecting portion formed on a surface of the prepreg to protrude from an end surface of the substrate.SELECTED DRAWING: Figure 1 【課題】接続用の部材と工程の追加を簡略化するとともに配線の寄生インダクタンスの増加を抑制したプリント配線板および電力変換装置を提供する。【解決手段】プリント配線板は、コア材と、コア材の表面に形成され、絶縁性を有するプリプレグと、を有する基板、プリプレグの表面に形成されると共に基板の端面から突出して形成された導電性接続部を有する内層パターン、を備えたものである。【選択図】図1
Bibliography:Application Number: JP20190065453