LAMINATE FILM, AND COMBINATION MEMBER FOR PRINTING WIRING BOARD

• Main Authors: BABA SUSUMU, HAYASHI TATSUJI, TANAKA TERUHISA
• Format: Patent
• Language: English; Japanese
• Published: 08.10.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a laminate film which can suppress occurrence of copper residues after etching.SOLUTION: A laminate film includes a base material, a resin layer layered on the surface of the base material, and a protective film layered on a surface opposite to the base material side of the resin layer, in which the resin layer contains an inorganic filler, and has an arithmetic average roughness Ra on the surface of the resin layer exposed by peeling of the protective film of 30 nm or more and 600 nm or less after the protective film has been peeled.SELECTED DRAWING: Figure 1 【課題】エッチング後の銅残りの発生を抑えることができる積層フィルムを提供する。【解決手段】本発明に係る積層フィルムは、基材と、前記基材の表面上に積層された樹脂層と、前記樹脂層の前記基材側とは反対の表面上に積層された保護フィルムとを備え、前記樹脂層は、無機充填材を含み、前記保護フィルムを剥離した後の、前記保護フィルムの剥離により露出した前記樹脂層の表面の算術平均粗さＲａが、３０ｎｍ以上、６００ｎｍ以下である。【選択図】図１