PHOTOSENSITIVE RESIN COMPOSITION

• Main Authors: EIZAI HIROSHI, OKAMOTO YOSHIO
• Format: Patent
• Language: English; Japanese
• Published: 01.10.2020
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COLOUR PRINTING; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; CORRECTION OF TYPOGRAPHICAL ERRORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; INKS; LINING MACHINES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; SELECTIVE PRINTING MECHANISMS; STAMPS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TYPEWRITERS; USE OF MATERIALS THEREFOR; WOODSTAINS

To provide a photosensitive resin composition that has excellent coatability by inkjet method, and can form a cured product having excellent adhesion between a conductor and a substrate material and excellent electric insulation.SOLUTION: A photosensitive resin composition contains (A) a liquid (meth) acrylate compound, (B) an NH group-containing (meth) acrylamide compound that has no hydroxy group, and (C) a photopolymerization initiator.SELECTED DRAWING: None 【課題】本発明は、インクジェット法での塗工性に優れ、また、導体と基板材料との密着性、及び電気絶縁性に優れた硬化物を形成することができる感光性樹脂組成物を提供することを目的とする。【解決手段】（Ａ）液状（メタ）アクリレート化合物と、（Ｂ）水酸基を含有しない、ＮＨ基含有（メタ）アクリルアミド化合物と、（Ｃ）光重合開始剤と、を含む感光性樹脂組成物。【選択図】なし