THERMOELECTRIC MODULE AND OPTICAL MODULE

• Main Authors: FUKUDA KATSUSHI, KOREEDA HARUKA, MATSUNAMI HIROYUKI, OTA TAKAAKI, TANAKA SATOSHI, KONISHI AKIO
• Format: Patent
• Language: English; Japanese
• Published: 24.09.2020
• Subjects: BLASTING; COMBINED HEATING AND REFRIGERATION SYSTEMS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; HEAT PUMP SYSTEMS; HEATING; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; REFRIGERATION MACHINES, PLANTS OR SYSTEMS; REFRIGERATION OR COOLING; WEAPONS

To provide a thermoelectric module capable of suppressing an occurrence of an electrical short circuit or disconnection.SOLUTION: A thermoelectric module 1 includes: electrodes 4 provided on a first surface 2A of a substrate 2; a first diffusion prevention layer 5 disposed between the electrode 4 and a thermoelectric element 3; and a bonding layer 6 provided between the electrode 4 and the first diffusion prevention layer 5. Further, the thermoelectric module 1 includes: a first metal layer 7 provided on a second surface 2B of the substrate 2; a second metal layer 8; and a second diffusion prevention layer 9 disposed between the first metal layer 7 and the second metal layer 8. The first diffusion prevention layer 5 contains a first material having lower ionization tendency than hydrogen.SELECTED DRAWING: Figure 2 【課題】電気的短絡又は断線の発生を抑制できる熱電モジュールを提供する。【解決手段】熱電モジュール１は、基板２の第１面２Ａに設けられる電極４と、電極４と熱電素子３との間に配置される第１拡散防止層５と、電極４と第１拡散防止層５との間に設けられる接合層６と、を備える。また、熱電モジュール１は、基板２の第２面２Ｂに設けられる第１金属層７と、第２金属層８と、第１金属層７と第２金属層８との間に配置される第２拡散防止層９と、を備える。第１拡散防止層５は、水素よりもイオン化傾向の低い第１材料を含む。【選択図】図２