PHOTOSENSITIVE RESIN COMPOSITION

• Main Authors: YODA MASANORI, HATADA NORIKO, NAKAMURA SHIGEO
• Format: Patent
• Language: English; Japanese
• Published: 24.09.2020
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a photosensitive resin composition which allows formation of a small-diameter via without causing an undercut at the via bottom.SOLUTION: The photosensitive resin composition comprises an epoxy resin (component (A)), a (meth)acrylate-modified phenolic resin (component (B)), a photopolymerization initiator (component (C)), and an inorganic filler (component (D)). The epoxy resin (component (A)) contains an epoxy resin having a number average molecular weight of 1000 or less; the inorganic filler (component (D)) is silica; when the non-volatile content in the photosensitive resin composition is set to 100 mass%, the content of the silica is 35 mass% or more; when the total number of phenolic hydroxyl groups and (meth)acrylate groups of (meth)acrylate-modified phenolic resin of the (meth)acrylate-modified phenolic resin (component (B)) is set to 100%, the percentage of the (meth)acrylate groups is 5 to 30%; and the silica comprises a silica having an average particle diameter of 0.01 μm to 0.15 μm.SELECTED DRAWING: None 【課題】ビア底部のアンダーカットを生じさせずに、小径ビアが形成できる感光性樹脂組成物を提供する。【解決手段】成分（Ａ）エポキシ樹脂、成分（Ｂ）（メタ）アクリレート変性フェノール樹脂、成分（Ｃ）光重合開始剤、及び成分（Ｄ）無機充填材を含有する感光性樹脂組成物であって、成分（Ａ）エポキシ樹脂は、数平均分子量が１０００以下のエポキシ樹脂を含み、成分（Ｄ）無機充填材がシリカであって、前記感光性樹脂組成物中の不揮発成分を１００質量％とした場合、前記シリカの含有量が３５質量％以上であり、成分（Ｂ）（メタ）アクリレート変性フェノール樹脂の（メタ）アクリレート変性フェノール樹脂のフェノール性水酸基と（メタ）アクリレート基との合計数を１００％とした場合の（メタ）アクリレート基の比率が５〜３０％であり、シリカが、平均粒径が０．０１μｍ〜０．１５μｍのシリカを含む、感光性樹脂組成物。【選択図】なし