HYBRID SYSTEMS AND METHODS FOR CHARACTERIZING STRESS IN CHEMICALLY STRENGTHENED TRANSPARENT SUBSTRATES

• Main Authors: NATHANIEL DAVID WETMORE, RYAN CLAUDE ANDREWS, JEREMIAH ROBERT JACOBSON, NEWCOMER GLENN ABRAM, RAJ BABAK ROBERT, PIERRE MICHEL BOUZI, ROSTISLAV VATCHEV ROUSSEV, STEPANOV VIKTOR, FURNAS WILLIAM JOHN, OLSON EVAN LEWIS
• Format: Patent
• Language: English; Japanese
• Published: 24.09.2020
• Subjects: CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; COLORIMETRY; GLASS; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; JOINING GLASS TO GLASS OR OTHER MATERIALS; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT; MEASURING; METALLURGY; MINERAL OR SLAG WOOL; PHYSICS; RADIATION PYROMETRY; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; TESTING

To perform both EPCS measurement and LSP measurement in a single measurement system.SOLUTION: A hybrid measurement system 20 includes an evanescent prism coupling spectroscopy (EPCS) sub-system 100 and a light-scattering polarimetry (LSP) sub-system 200. The EPCS sub-system 100 includes an EPCS light source optically coupled to an EPCS detector system 140 through an EPCS coupling prism. The LSP sub-system 200 includes an LSP light source optically coupled to an optical compensator 230, and the optical compensator 230 is optically coupled to an LSP detector system 240 via an LSP coupling prism. A support structure supports the EPCS coupling prism and the LSP coupling prism to define a coupling prism assembly, which supports the two prisms at a measurement location. Stress measurement performed using the EPCS sub-system and the LSP sub-system are combined to fully characterize stress of a transparent chemically strengthened substrate.SELECTED DRAWING: Figure 2A 【課題】 単一の測定システムでＥＰＣＳ測定及びＬＳＰ測定の両方を実施する。【解決手段】 ハイブリッド測定システム２０は、エバネッセントプリズム結合分光法（ＥＰＣＳ）サブシステム１００及び光散乱偏光測定（ＬＳＰ）サブシステム２００を含む。ＥＰＣＳサブシステム１００は、ＥＰＣＳ結合プリズムを通してＥＰＣＳ検出器システム１４０に光学的に結合されたＥＰＣＳ光源を含む。ＬＳＰサブシステム２００は、光補償板２３０に光学的に結合されたＬＳＰ光源を含み、光補償板２３０は、ＬＳＰ結合プリズムを介してＬＳＰ検出器システム２４０に光学的に結合される。支持構造体は、ＥＰＣＳ結合プリズム及びＬＳＰ結合プリズムを支持して結合プリズム組立体を画定し、これは上記２つのプリズムを測定位置において支持する。ＥＰＣＳサブシステム及びＬＳＰサブシステムを用いて行われる応力測定を組み合わせることにより、透明化学強化基板の応力を完全に特性決定する。【選択図】 図２Ａ