ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: IWATA KAZUYUKI, GOTO SHUN
• Format: Patent
• Language: English; Japanese
• Published: 17.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide an electronic device and a manufacturing method thereof capable of obtaining good conductivity between a conductive bump and the other electrode.SOLUTION: An electronic device such as a semiconductor device 1 includes a wiring board 5, a surface mount component such as a surface mount IC2 surface-mounted on the wiring board 5, a conductive bump 7 formed on one of an electrode such as a wiring 4A of the wiring board 5 and a connection electrode 2A of the surface mount component and contacting the other electrode to connect the electrodes, and an insulating resin that fixes the surface mount component and the wiring board to each other, and a part of the conductive bump 7 breaks an oxide film on the surface of the other electrode and is in contact with the other electrode.SELECTED DRAWING: Figure 1 【課題】導電バンプと他方の電極との間で良好な導通性を得ることができる電子装置、および電子装置の製造方法を提供する。【解決手段】配線基板５と、配線基板５上に表面実装される表面実装ＩＣ２などの表面実装部品と、配線基板５の配線４Ａなどの電極および表面実装部品の接続電極２Ａなどの電極のいずれか一方の電極上に形成され他方の電極に接触して電極間を接続する導電バンプ７と、表面実装部品と配線基板とを互いに固定する絶縁性樹脂とを備えた半導体装置１などの電子装置において、導電バンプ７の一部が他方の電極の表面の酸化被膜を破って他方の電極と接触している。【選択図】図１