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Summary:To provide a method for manufacturing a plated component, capable of suppressing the deposition of an electroless plating film except a predetermined region on an inorganic base material to form the electroless plating film only in the predetermined region.SOLUTION: The method for manufacturing a plated component comprises: forming a catalytic activity interference layer including a catalyst inactivator (a hyperbranched polymer, etc.) on the smooth surface of an inorganic base material having a smooth surface having a surface roughness (Ra) of 1 μm or less; irradiating and removing a part of the catalytic activity interference layer on the base material with a laser beam; applying an electroless plating catalyst to the surface of the inorganic base material irradiated with the laser beam; and contacting an electroless plating liquid to the surface of the inorganic base material having the applied electroless plating catalyst to form an electroless plating film in a region irradiated with the laser beam.SELECTED DRAWING: Figure 1 【課題】無機基材上において、所定領域以外での無電解メッキ膜の析出を抑制して、所定領域のみに無電解メッキ膜を形成できるメッキ部品の製造方法を提供する。【解決手段】メッキ部品の製造方法であって、表面粗さ(Ra)が1μm以下である平滑面を有する無機基材の前記平滑面上に、触媒失活剤(ハイパーブランチポリマー等)を含む触媒活性妨害層を形成することと、前記基材上の前記触媒活性妨害層の一部にレーザー光を照射して除去することと、前記レーザー光を照射した無機基材の表面に無電解メッキ触媒を付与することと、前記無電解メッキ触媒を付与した無機基材の表面に無電解メッキ液を接触させ、前記レーザー光を照射した領域に無電解メッキ膜を形成することを含む。【選択図】図1
Bibliography:Application Number: JP20190046095