VINYL CHLORIDE-BASED PLASTISOL COMPOSITION

• Main Author: MIHARA SATOSHI
• Format: Patent
• Language: English; Japanese
• Published: 17.09.2020
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To form a coated film which has high sound insulation property on a wide range of baking temperature condition, and has good chipping resistance while having low specific gravity.SOLUTION: A vinyl chloride-based plastisol composition contains a vinyl chloride/vinyl acetate copolymer resin which has an average degree of polymerization of 1,800-2,300 and has a content of a vinyl acetate residue of 8 mass% or more and 10 mass% or less, a plasticizer thereof, a hollow filler, and a low temperature expanded microcapsule having an expansion initiation temperature of 85°C or higher and 110°C or lower and a maximum expansion temperature of 120°C or higher and 140°C or lower and a high temperature expanded microcapsule having an expansion initiation temperature of 95°C or higher and 120°C or lower and a maximum expansion temperature of 145°C or higher and 170°C or lower as thermally expansible microcapsules.SELECTED DRAWING: None 【課題】広範囲の焼付け温度条件で、防音性が高く、かつ、低比重でありながら耐チッピング性が良好な塗膜を形成できること。【解決手段】塩化ビニル系プラスチゾル組成物は、平均重合度が１８００〜２３００の範囲内であり、酢酸ビニル残基含有量が８質量％以上、１０質量％以下である塩化ビニル／酢酸ビニル共重合体樹脂と、その可塑剤と、中空フィラと、熱膨張性マイクロカプセルとして、膨張開始温度が８５℃以上、１１０℃以下、かつ、最大膨張温度が１２０℃以上、１４０℃以下の範囲内である低温膨張マイクロカプセル、及び、膨張開始温度が９５℃以上、１２０℃以下の範囲内で、かつ、最大膨張温度が１４５℃以上、１７０℃以下の範囲内である高温膨張マイクロカプセルとを含有したものである。【選択図】なし