FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS
To provide an improved method for forming a vertical wire interconnect formation.SOLUTION: A wire bonding method comprises the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and th...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
10.09.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide an improved method for forming a vertical wire interconnect formation.SOLUTION: A wire bonding method comprises the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and the remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.SELECTED DRAWING: Figure 1
【課題】垂直ワイヤ相互接続構造を形成する改善された方法を提供する。【解決手段】ワイヤボンディング方法であって、ボンディングワイヤを細管から或る長さ延ばしてワイヤテールを形成する工程と、前記ワイヤテールと前記細管内にある残りのボンディングワイヤとの間に弱化部を形成すべく、前記ワイヤテールの一つの点を変形させる工程と、前記ワイヤテールをボンディングパッド及び基板の少なくとも一方に接合する前に、前記弱化部を含む前記ワイヤテールの少なくとも一部を前記細管の内部に引き戻す工程と、を有してなるワイヤボンディング方法。【選択図】図1 |
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Bibliography: | Application Number: JP20200036965 |