SEMICONDUCTOR STORAGE DEVICE

To suppress an increase in a chip area.SOLUTION: According to an embodiment, a semiconductor storage device includes: a first semiconductor layer 31 including first to third portions (HPR1 to HPR3) arranged side by side in a first direction and having different positions with each other in a second...

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Main Authors NAKATSUKA KEISUKE, MOMO NOBUYUKI, ARAI FUMITAKA, HOSOYA KEIJI, FUJIMATSU MOTOHIKO
Format Patent
LanguageEnglish
Japanese
Published 10.09.2020
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Summary:To suppress an increase in a chip area.SOLUTION: According to an embodiment, a semiconductor storage device includes: a first semiconductor layer 31 including first to third portions (HPR1 to HPR3) arranged side by side in a first direction and having different positions with each other in a second direction; a conductive layer 39 including a fourth portion 39a extending in the second direction and a fifth portion 39b extending in the first direction; a first insulation layer 38 provided between the fourth portion and the first semiconductor layer and between the fifth portion and the first semiconductor layer; a first contact plug CSGD connected to the fourth portion; a second contact plug CBL connected to the first semiconductor layer in a region in which the first insulation layer is formed; first wiring CWL; and a first memory cell storing information between the first semiconductor layer and the first wiring.SELECTED DRAWING: Figure 10 【課題】チップ面積の増加を抑制する。【解決手段】実施形態によれば、半導体記憶装置は、第1方向に並んで配置され、第2方向における位置が互いに異なる第1乃至第3部分(HPR1〜HPR3)を含む第1半導体層31と、第2方向に延伸する第4部分39a及び第1方向に延伸する第5部分39bを含む導電層39と、第4部分と第1半導体層との間、及び第5部分と第1半導体層との間に設けられた第1絶縁層38と、第4部分と接続された第1コンタクトプラグCSGDと、第1絶縁層が形成されている領域内で第1半導体層と接続される第2コンタクトプラグCBLと、第1配線CWLと、第1半導体層と第1配線との間で情報を記憶する第1メモリセルとを含む。【選択図】図10
Bibliography:Application Number: JP20190040267