WAFER MOUNTING STRUCTURE, HEATER AND WAFER MOUNTING DEVICE USING THE SAME, AND MANUFACTURING METHOD OF THE WAFER MOUNTING STRUCTURE

• Main Authors: MARUYAMA KAZUTO, MORIYAMA MASAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 03.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a wafer mounting structure for allowing a fluid to quickly approach a desired temperature, a heater and a wafer mounting device using the same, and a manufacturing method of the wafer mounting structure.SOLUTION: A wafer mounting structure 20 has a ceramic substrate 40 including a first surface 81 on which a wafer is mounted. The substrate 40 has a flow path 60 inside. The flow path 60 has a region 64 in which a height of the flow path 60 is higher than the others at least in a part along a direction in which the flow path 60 extends.SELECTED DRAWING: Figure 3 【課題】流体を所望温度に早く近づけることができるウエハ載置構造体、前記ウエハ載置構造体を用いたヒータ及びウエハ載置装置、並びに前記ウエハ載置構造体の製造方法を提供すること。【解決手段】ウエハ載置構造体２０は、ウエハが載置される第１面８１を備えたセラミックス製の基体４０を有している。基体４０は、内部に流路６０を有している。流路６０は、流路６０が延びる方向に沿った少なくとも一部に、流路６０の高さが他より高い領域６４を有している。【選択図】図３