CRACK DETECTION LABEL

To detect a crack in an early stage with simple operation.SOLUTION: A crack detection label 1 comprises a film substrate 10, an adhesive layer 30 laminated on one surface of the film substrate 10, a crack detection wiring 13 formed on the other surface of the film substrate 10, and an IC chip 11 con...

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Main Authors SATO YOSHI, KOMODA NATSUKI, TOSEI DAISUKE, MATSUYASU RYO, NISHIMURA TAKEHIRO, MIYAMOTO KAKU
Format Patent
LanguageEnglish
Japanese
Published 03.09.2020
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Summary:To detect a crack in an early stage with simple operation.SOLUTION: A crack detection label 1 comprises a film substrate 10, an adhesive layer 30 laminated on one surface of the film substrate 10, a crack detection wiring 13 formed on the other surface of the film substrate 10, and an IC chip 11 connected to the crack detection wiring 13 to detect a conduction state of the crack detection wiring 13. The crack detection wiring 13 includes wiring parts 13a and 13b each having one end connected to the IC chip 11 and the other end opened. The wiring parts 13a and 13b includes junction parts 14a and 14b, respectively at the opened ends, which are exposed on the other surface of the film substrate 10 and the other ends of which are electrically connected by conductive material supplied across a crack detection place in an area, not facing the film substrate 10, of an adherend when the crack detection label is adhered onto the adherend.SELECTED DRAWING: Figure 1 【課題】簡易な作業で、亀裂を早期に検知する。【解決手段】フィルム基板10と、フィルム基板10の一方の面に積層された粘着層30と、フィルム基板10の他方の面に形成された亀裂検知用配線13と、亀裂検知用配線13に接続され、亀裂検知用配線13の導通状態を検出するICチップ11とを有し、亀裂検知用配線13は、一方の端部がICチップ11に接続され、他方の端部が開放された配線部13a,13bを具備し、配線部13a,13bは、開放された端部に、フィルム基板10の他方の面にて表出し、亀裂検知用ラベル1が被着体に貼着された場合に被着体のフィルム基板10に対向しない領域に亀裂の検知箇所を跨いで供給された導電性材料によって他方の端部どうしが電気的に接続される接合部14a,14bを具備する。【選択図】図1
Bibliography:Application Number: JP20190037320