POLYETHYLENE RESIN COMPOSITION, AND MOLDING

• Main Authors: YOSHIMOTO KEIICHI, TANAKA YOSHIO
• Format: Patent
• Language: English; Japanese
• Published: 03.09.2020
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a polyethylene resin composition which achieves high levels of rigidity, flowability, resistance to environmental stress crack and impact resistance.SOLUTION: A polyethylene resin composition contains 10 pts.mass or more and 100 pts.mass or less of a modifier for polyethylene resin, which contains a specific polyethylene component (A) and a specific polyethylene component (B) in each specific amount and satisfies the following characteristics (i) to (iii), with respect to 100 pts.mass of a polyethylene component (P) satisfying the following characteristics (p1) to (p2). Polyethylene component (P); Characteristic (p1): MFR of more than 100 g/10 min and 300 g/10 min or less, and Characteristic (p2); density of 0.960 g/cm3 or more and 0.980 g/cm3 or less. Modifier for polyethylene resin; Characteristic (i): HLMFR of 1 g/10 min or more and 20 g/10 min or less, Characteristic (ii): HLMFR/MFR of 20 or more and 80 or less, and Characteristic (iii): density of 0.930 g/cm3 or more and 0.952 g/cm3 or less.SELECTED DRAWING: None 【課題】高度な剛性、流動性、耐環境応力亀裂性、衝撃性等を達成するポリエチレン樹脂組成物の提供。【解決手段】下記特性（ｐ１）〜（ｐ２）を満足するポリエチレン成分（Ｐ）１００質量部に対して、特定のポリエチレン成分（Ａ）及び特定のポリエチレン成分（Ｂ）を各々特定量含有し、下記の特性（ｉ）〜（ｉｉｉ）を満足するポリエチレン樹脂用改質材を１０質量部以上１００質量部以下含む、ポリエチレン樹脂組成物。ポリエチレン成分（Ｐ）；特性（ｐ１）：ＭＦＲが１００ｇ／１０分を超え３００ｇ／１０分以下、特性（ｐ２）：密度が０．９６０ｇ／ｃｍ３以上０．９８０ｇ／ｃｍ３以下。ポリエチレン樹脂用改質材；特性（ｉ）：ＨＬＭＦＲが１ｇ／１０分以上２０ｇ／１０分以下、特性（ｉｉ）：ＨＬＭＦＲ／ＭＦＲが２０以上８０以下、特性（ｉｉｉ）：密度が０．９３０ｇ／ｃｍ３以上０．９５２ｇ／ｃｍ３以下。【選択図】なし