POLYPHENYLENE ETHER-CONTAINING RESIN COMPOSITION AND ELECTRONIC CIRCUIT BOARD MATERIAL

To provide a polyphenylene ether-containing resin composition capable of providing a cured product excellent in electric characteristics, heat resistance and low thermal expansion characteristics.SOLUTION: A resin composition contains polyphenylene ether, a crosslinking agent and an organic peroxide...

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Bibliographic Details
Main Authors SUGIMURA SEIJI, OSADA KAZUTO, ENDO MASAO
Format Patent
LanguageEnglish
Japanese
Published 03.09.2020
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Summary:To provide a polyphenylene ether-containing resin composition capable of providing a cured product excellent in electric characteristics, heat resistance and low thermal expansion characteristics.SOLUTION: A resin composition contains polyphenylene ether, a crosslinking agent and an organic peroxide. The polyphenylene ether has average 1.5 to 5 functional groups containing carbon-carbon double bonds in a main chain terminal in one molecule and has a number average molecular weight of 1,000 or more and 4,200 or less. The crosslinking agent has average 2 or more carbon-carbon double bonds in one molecule and has a number average molecular weight of 4,000 or less, and a weight ratio of the polyphenylene ether to the crosslinking agent is 62:38 to 94:6. The organic peroxide is an organic peroxide having an aromatic ring, and a content of the organic peroxide is 0.05 pt.mass or more and 0.9 pt.mass or less with respect to 100 pts.mass of the total of the polyphenylene ether and the crosslinking agent.SELECTED DRAWING: None 【課題】電気特性、耐熱性、及び低熱膨張特性に優れる硬化物を提供することのできる、ポリフェニレンエーテル含有樹脂組成物を提供すること。【解決手段】ポリフェニレンエーテル、架橋剤、及び有機過酸化物を含む樹脂組成物。ポリフェニレンエーテルは、その主鎖末端に炭素−炭素二重結合を含む官能基を1分子中に平均1.5〜5個有し、かつ数平均分子量が、1000以上4200以下である。上記架橋剤は、炭素−炭素不飽和二重結合を1分子中に平均2個以上有し、かつ数平均分子量が4000以下であり、上記ポリフェニレンエーテルと上記架橋剤との重量比は、前者:後者=62:38〜94:6である。上記有機過酸化物は、芳香環を有する有機過酸化物であり、上記有機過酸化物の含有量は、上記ポリフェニレンエーテル及び上記架橋剤の合計100質量部に対し、0.05質量部以上0.9質量部以下である。【選択図】なし
Bibliography:Application Number: JP20190038015