SURFACE-COATED CUTTING TOOL HAVING HARD COATING LAYER EXERTING EXCELLENT CHIPPING RESISTANCE
To provide a surface-coated cutting tool having excellent chipping resistance and exerting superior cutting performance for a long term even in a high-speed intermittent cutting process for a cast iron or the like.SOLUTION: In a surface-coated cutting tool, a hard coating layer having an average lay...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
03.09.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a surface-coated cutting tool having excellent chipping resistance and exerting superior cutting performance for a long term even in a high-speed intermittent cutting process for a cast iron or the like.SOLUTION: In a surface-coated cutting tool, a hard coating layer having an average layer thickness of 1.5-25.0 μm has: a layer of a tool surface side which consists mainly of a hexagonal crystal structure having an average layer thickness of 0.5-5.0 μm, satisfies 0.70≤xα≤0.95 and 0.0000≤yα≤0.0150 (here, xα, yα are the average values of atomic ratio) in a composition: (AlxαMe1-xα)(CyαN1-yα)(here, Me is one or more of Si, Zr, V, Cr, Nb, Hf and Mn), and has a push-in hardness of nanoindentation of 15-28 GPa; and the layer of a tool substrate side which consists mainly of a cubic crystal structure having the average layer thickness of 1.0-20.0 μm, satisfies 0.65≤xβ≤0.95 and 0.0000≤yβ≤0.0150 (xβ, yβ are the average values of atomic ratio) in the composition: (AlxβTi1-xβ)(CyβN1-yβ), and has the push-in hardness of nanoindentation of 30-45 GPa.SELECTED DRAWING: Figure 1
【課題】鋳鉄等の高速断続切削加工でも優れた耐チッピングを有し長期間優れた切削性能を発揮する工具を提供【解決手段】工具基体表面の1.5〜25.0μmの平均層厚の硬質被覆層は、平均層厚0.5〜5.0μmの六方晶構造を主とする(AlxαMe1 -xα)(CyαN1−yα)(MeはSi、Zr、V、Cr、Nb、Hf、Mnの一種以上)が、0.70≦xα≦0.95かつ0.0000≦yα≦0.0150(xα、yαは原子比の平均値)でナノインデンテーション押込み硬さ15〜28GPaの工具表面側の層と平均層厚1.0〜20.0μmの立方晶構造を主とする(AlxβTi1 -xβ)(CyβN1−yβ)が0.65≦xβ≦0.95かつ0.0000≦yβ≦0.0150(xβ、yβは原子比の平均値)でナノインデンテーション押込み硬さ30G〜45GPaの工具基体側の層とを有する表面被覆切削工具【選択図】図1 |
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Bibliography: | Application Number: JP20190037245 |