PLACEMENT BASE AND SUBSTRATE PROCESSING DEVICE

• Main Author: KOIWA SHINGO
• Format: Patent
• Language: English; Japanese
• Published: 31.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a placement base which protects a joint layer, and to provide a substrate processing device.SOLUTION: A placement base includes: a base; a substrate placement part provided on an upper surface of the base; an annular member placement part provided at the outer side of the substrate placement part on an upper surface of the base; a first joint layer which joins the base and the substrate placement part to each other; a second joint layer which joins the base and the annular member placement part to each other; an annular member placed on the annular member placement part; and a seal member which protects the first joint layer and the second joint layer.SELECTED DRAWING: Figure 2 【課題】接合層を保護する載置台及び基板処理装置を提供する。【解決手段】基台と、前記基台の上面に設けられる基板載置部と、前記基台の上面で前記基板載置部の外側に設けられる環状部材載置部と、前記基台と前記基板載置部とを接合する第１接合層と、前記基台と前記環状部材載置部とを接合する第２接合層と、前記環状部材載置部に載置される環状部材と、前記第１接合層及び前記第２接合層を保護するシール部材と、を備える、載置台。【選択図】図２