SUBSTRATE PROCESSING APPARATUS

To provide a substrate processing apparatus capable of improving the uniformity of flow velocity in the plane of a substrate.SOLUTION: A substrate processing apparatus according to an embodiment includes a processing tank that stores a chemical solution for processing a substrate, a pipe having a di...

Full description

Saved in:
Bibliographic Details
Main Authors SATO KATSUHIRO, NAKAOKA SATOSHI, KITAMURA YOSHINORI
Format Patent
LanguageEnglish
Japanese
Published 31.08.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:To provide a substrate processing apparatus capable of improving the uniformity of flow velocity in the plane of a substrate.SOLUTION: A substrate processing apparatus according to an embodiment includes a processing tank that stores a chemical solution for processing a substrate, a pipe having a discharge port that discharges bubbles from the bottom of the processing tank toward the substrate, and a rod-shaped body that is arranged between the discharge port and the substrate and divides the bubbles.SELECTED DRAWING: Figure 1 【課題】基板面内における流速の均一性を向上させることが可能な基板処理装置を提供する。【解決手段】一実施形態に係る基板処理装置は、基板を処理する薬液を貯留する処理槽と、処理槽の底部から基板に向けて気泡を吐出する吐出口を有する配管と、吐出口と基板との間に配置され、気泡を分割する棒状体と、を備える。【選択図】図１
Bibliography:Application Number: JP20190029748