SEMICONDUCTOR DEVICE
To provide a technique capable of improving the manufacturing quality of a semiconductor device.SOLUTION: A semiconductor device according to the present disclosure includes a semiconductor element and a signal terminal. The semiconductor element has a signal pad. The signal terminal has a flat surf...
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| Format | Patent |
| Language | English Japanese |
| Published |
31.08.2020
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| Subjects | |
| Online Access | Get full text |
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| Abstract | To provide a technique capable of improving the manufacturing quality of a semiconductor device.SOLUTION: A semiconductor device according to the present disclosure includes a semiconductor element and a signal terminal. The semiconductor element has a signal pad. The signal terminal has a flat surface facing the signal pad. At the same time, the flat surface is joined to the signal pad with a spacer interposed therebetween. In addition, the flat surface is larger than the signal pad in at least one direction parallel to the flat surface.SELECTED DRAWING: Figure 4
【課題】半導体装置の製造品質を向上し得る技術を提供する。【解決手段】本明細書が開示する半導体装置は、半導体素子と、信号端子とを備える。半導体素子は、信号パッドを有している。信号端子は、その信号パッドに対向する平坦なフラット面を有している。それとともに、フラット面は、スペーサを挟んで信号パッドに接合されている。加えて、フラット面は、そのフラット面に平行な少なくとも一つの方向において、信号パッドよりも大きい。【選択図】図４ |
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| AbstractList | To provide a technique capable of improving the manufacturing quality of a semiconductor device.SOLUTION: A semiconductor device according to the present disclosure includes a semiconductor element and a signal terminal. The semiconductor element has a signal pad. The signal terminal has a flat surface facing the signal pad. At the same time, the flat surface is joined to the signal pad with a spacer interposed therebetween. In addition, the flat surface is larger than the signal pad in at least one direction parallel to the flat surface.SELECTED DRAWING: Figure 4
【課題】半導体装置の製造品質を向上し得る技術を提供する。【解決手段】本明細書が開示する半導体装置は、半導体素子と、信号端子とを備える。半導体素子は、信号パッドを有している。信号端子は、その信号パッドに対向する平坦なフラット面を有している。それとともに、フラット面は、スペーサを挟んで信号パッドに接合されている。加えて、フラット面は、そのフラット面に平行な少なくとも一つの方向において、信号パッドよりも大きい。【選択図】図４ |
| Author | KAWASHIMA TAKAYOSHI |
| Author_xml | – fullname: KAWASHIMA TAKAYOSHI |
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| Notes | Application Number: JP20190028856 |
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| RelatedCompanies | TOYOTA MOTOR CORP |
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| Snippet | To provide a technique capable of improving the manufacturing quality of a semiconductor device.SOLUTION: A semiconductor device according to the present... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SEMICONDUCTOR DEVICE |
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