SEMICONDUCTOR DEVICE

To provide a technique capable of improving the manufacturing quality of a semiconductor device.SOLUTION: A semiconductor device according to the present disclosure includes a semiconductor element and a signal terminal. The semiconductor element has a signal pad. The signal terminal has a flat surf...

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Bibliographic Details
Main Author KAWASHIMA TAKAYOSHI
Format Patent
LanguageEnglish
Japanese
Published 31.08.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a technique capable of improving the manufacturing quality of a semiconductor device.SOLUTION: A semiconductor device according to the present disclosure includes a semiconductor element and a signal terminal. The semiconductor element has a signal pad. The signal terminal has a flat surface facing the signal pad. At the same time, the flat surface is joined to the signal pad with a spacer interposed therebetween. In addition, the flat surface is larger than the signal pad in at least one direction parallel to the flat surface.SELECTED DRAWING: Figure 4 【課題】半導体装置の製造品質を向上し得る技術を提供する。【解決手段】本明細書が開示する半導体装置は、半導体素子と、信号端子とを備える。半導体素子は、信号パッドを有している。信号端子は、その信号パッドに対向する平坦なフラット面を有している。それとともに、フラット面は、スペーサを挟んで信号パッドに接合されている。加えて、フラット面は、そのフラット面に平行な少なくとも一つの方向において、信号パッドよりも大きい。【選択図】図４
Bibliography:Application Number: JP20190028856