ELECTRONIC DEVICE HOUSING, DEVELOPED METAL RESIN BONDING PLATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE HOUSING, AND ELECTRONIC DEVICE

• Main Author: NAITO MASAYA
• Format: Patent
• Language: English; Japanese
• Published: 31.08.2020
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

To provide an electronic device housing which has an excellent balance of lightness, electromagnetic wave shielding property, heat radiation property, and mechanical strength.SOLUTION: An electronic device housing includes a plastic bottom plate, and a plastic side plate that is integrally bent and connected to the plastic bottom plate, and stores an electronic device inside, and at least one selected from the plastic bottom plate and the plastic side plate is a plate in which plastic is joined and integrated on both sides of the mesh metal plate (M).SELECTED DRAWING: Figure 1 【課題】軽量性、電磁波シールド性、放熱特性および機械的強度のバランスに優れた電子機器用筐体を提供する。【解決手段】プラスチック底板と、上記プラスチック底板に一体的に折り曲げられて連結されたプラスチック側板とを備えた、内部に電子機器を収容するための筐体であって、上記プラスチック底板および上記プラスチック側板から選ばれる少なくとも一枚が、網状金属板（Ｍ）の両面にプラスチックが接合一体化している板である電子機器用筐体。【選択図】図１