MULTISTORY BASE INSULATION BUILDING
To provide a multistory base isolation building capable of effectively coping with a small and medium scale earthquake vibration of high occurrence frequency to an excessive earthquake vibration exceeding a normal design level.SOLUTION: A multilayer base isolation building 1A, which is one 1A provid...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
31.08.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | To provide a multistory base isolation building capable of effectively coping with a small and medium scale earthquake vibration of high occurrence frequency to an excessive earthquake vibration exceeding a normal design level.SOLUTION: A multilayer base isolation building 1A, which is one 1A provided with a plurality of base isolation layers 4, is configured by connecting a lower structure 2, a lower base isolation layer 40, an intermediate structure 31, an intermediate base isolation layer 50, and an upper structure 32 from the lower side to the upper side. Either one base isolation layer 40 of the lower base isolation layer 40 and the intermediate base isolation layer 50 has a horizontal rigidity set smaller than that of the other base isolation layer 50 and is provided with a rigidity imparting mechanism 43 for increasing the horizontal rigidity of the one base isolation layer 40 in accordance with a deformation of the one base isolation layer 40, and the other base isolation layer 50 is deformed in a state where the horizontal rigidity of the one base isolation layer 40 is increased by the rigidity imparting mechanism 43 when an earthquake occurs.SELECTED DRAWING: Figure 1
【課題】発生頻度の高い中小規模の地震動から、通常の設計レベルを超える過大な地震動まで、効果的に対応可能な、複層免震建物を提供する。【解決手段】複層免震建物1Aは、免震層4を複数備えた複層免震建物1Aであって、下側から上側に向かって、下部構造物2、下部免震層40、中間構造物31、中間免震層50、及び上部構造物32が連結されて構成されており、下部免震層40及び中間免震層50のいずれか一方の免震層40は、水平剛性が他方の免震層50より小さく設定され、かつ、一方の免震層40の変形に伴って一方の免震層40の水平剛性を上昇させる剛性付与機構43を備え、他方の免震層50は、地震動発生時に剛性付与機構43により一方の免震層40の水平剛性が上昇した状態で変形する。【選択図】図1 |
---|---|
Bibliography: | Application Number: JP20190027915 |