DRESSER MANUFACTURING METHOD

• Main Authors: MATSUI YUKITERU, KAWASE AKIFUMI, KAWASAKI TAKAHIKO
• Format: Patent
• Language: English; Japanese
• Published: 13.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

To provide a polishing pad dresser excellent in high productivity and a manufacturing method thereof.SOLUTION: In a dresser manufacturing method according to an embodiment, a chip portion is prepared in which a Si substrate having a plurality of protrusions on the surface is singulated, a diamond thin film layer is formed on the protrusions of the chip portion to provide the chip portion in which the diamond thin film layer is formed on a base metal. The protrusions are formed by etching the Si substrate with a gas containing C and F.SELECTED DRAWING: Figure 1 【課題】高生産性に優れた研磨パッドドレッサー及びその製造方法を提供する。【解決手段】実施形態のドレッサーの製造方法は、表面に複数の突起を有するＳｉ基板が個片化されたチップ部を用意し、前記チップ部の前記突起上にダイヤモンド薄膜層を形成し、台金上に前記ダイヤモンド薄膜層が形成された前記チップ部を設ける。前記突起は、前記Ｓｉ基板をＣとＦを含むガスを用いてエッチングすることにより形成される。【選択図】図１