COMPOSITION FOR FORMING CONDUCTIVE BUMP

To provide a composition for forming a conductive bump that can easily form a conductive bump with a large aspect ratio (H/L) of a height H to a diameter L of a bottom surface and a small radius of curvature R of a vertical cross section of a tip, with a single discharge using a dispenser.SOLUTION:...

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Bibliographic Details
Main Author OKAMOTO TOMOKO
Format Patent
LanguageEnglish
Japanese
Published 13.08.2020
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:To provide a composition for forming a conductive bump that can easily form a conductive bump with a large aspect ratio (H/L) of a height H to a diameter L of a bottom surface and a small radius of curvature R of a vertical cross section of a tip, with a single discharge using a dispenser.SOLUTION: A composition for forming a conductive bump includes conductive particles, a binder resin, and a solvent, and a viscosity Swhen the shear rate is 10 s, measured at 25°C using a rotary rheometer, is 80 to 200 Pa s, and a viscosity Sat a shear rate of 100 smeasured at 25°C using the rotary rheometer is 5 to 50 Pa s.SELECTED DRAWING: Figure 1 【課題】底面の直径Ｌに対する高さＨのアスペクト比（Ｈ／Ｌ）が大きく、尖端部の縦断面の曲率半径Ｒが小さな導電性バンプを、ディスペンサーを用いて１回の吐出で容易に形成可能な、導電性バンプ形成用組成物の提供。【解決手段】導電性粒子と、バインダー樹脂と、溶剤と、を含有し、回転式レオメーターを用いて２５℃で測定される、せん断速度が１０ｓ−１のときの粘度Ｓ１０が、８０〜２００Ｐａ・ｓであり、回転式レオメーターを用いて２５℃で測定される、せん断速度が１００ｓ−１のときの粘度Ｓ１００が、５〜５０Ｐａ・ｓである導電性バンプ形成用組成物。【選択図】図１
Bibliography:Application Number: JP20190013619