DEVICE AND METHOD FOR HEAT TREATMENT OF ELECTRONIC DEVICE

To provide a device and a technique for heat treatment of electronic device.SOLUTION: A device and a technique are used for manufacturing an electronic device capable of including an organic light-emitting diode (OLED) device. Such a device and a technique can include usage of one or more modules ha...

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Bibliographic Details
Main Authors CONOR F MADIGAN, JUSTIN MAUCK, ALEXANDER SOU-KANG KO, ELIYAHU VRONSKY
Format Patent
LanguageEnglish
Japanese
Published 13.08.2020
Subjects
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
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Summary:To provide a device and a technique for heat treatment of electronic device.SOLUTION: A device and a technique are used for manufacturing an electronic device capable of including an organic light-emitting diode (OLED) device. Such a device and a technique can include usage of one or more modules having a controlled environment. For example, a board can be received from a print system located in a first processing environment, and also the board may be provided with a controlled second processing environment such as an enclosed heat treatment module. The second processing environment may includes a refinement gas environment having a constitution different from the first processing environment.SELECTED DRAWING: None 【課題】電子デバイスの熱処理のための装置および技法を提供すること【解決手段】装置および技法が、有機発光ダイオード（ＯＬＥＤ）デバイスを含むことができるような電子デバイスを製造することにおいて使用するために本明細書に説明される。そのような装置および技法は、制御された環境を有する１つ以上のモジュールを使用することを含むことができる。例えば、基板は、第１の処理環境内に位置する印刷システムから受け取られることができ、基板は、制御された第２の処理環境を備えている封入型熱処理モジュール等の第２の処理環境を提供されることができる。第２の処理環境は、第１の処理環境と異なる組成を有する精製ガス環境を含むことができる。【選択図】なし
Bibliography:Application Number: JP20200088797