JOINING DEVICE AND JOINING METHOD

• Main Authors: SUGAKAWA KENJI, OMORI YOSUKE
• Format: Patent
• Language: English; Japanese
• Published: 06.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To control distortion of a substrate to be adsorbed to an adsorption surface.SOLUTION: A substrate processing device comprises: on an adsorption surface for adsorbing a substrate, a holding part having, as a plurality of regions where adsorption pressure for adsorbing the substrate are controlled independently, a circular first region and an annular second region disposed outward in a radial direction of the first region; a plurality of adsorption pressure generating parts for independently generating the adsorption pressure for the plurality of respective regions constituting the adsorption surface; a plurality of adsorption pressure adjusting parts for independently adjusting the adsorption pressure generated by the plurality of respective adsorption pressure generating parts; and a control part for controlling the plurality of adsorption pressure generating parts and the plurality of adsorption pressure adjusting parts. The control part causes different adsorption pressures to be generated in at least part of the first region and in at least part of the second region.SELECTED DRAWING: Figure 9 【課題】吸着面に吸着される基板の歪みを制御すること。【解決手段】基板を吸着する吸着面に、前記基板を吸着する吸着圧力が独立に制御される複数の領域として、円状の第１領域および前記第１領域の径方向外側に配置される円環状の第２領域を有する保持部と、前記吸着面を構成する複数の領域のそれぞれに独立に吸着圧力を発生させる複数の吸着圧力発生部と、複数の前記吸着圧力発生部のそれぞれによって発生される吸着圧力を独立に調整する複数の吸着圧力調整部と、複数の前記吸着圧力発生部および複数の前記吸着圧力調整部を制御する制御部とを備え、前記制御部は、前記第１領域の少なくとも一部と前記第２領域の少なくとも一部とに異なる前記吸着圧力を発生させる、基板処理装置。【選択図】図９