LIGHT EMITTING DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE

• Main Authors: TAKAO TOSHIKIMI, MURATA YOSHIAKI, YAGI TETSUYA
• Format: Patent
• Language: English; Japanese
• Published: 06.08.2020
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LABELS OR NAME-PLATES; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; SIGNS

To provide a manufacturing method of a package and a manufacturing method of a light emitting device that reduce manufacturing costs.SOLUTION: A light emitting device 100 includes a package 30 including a resin molded body 2 formed in a polygonal shape in a top view, having a recess 3 on the upper surface, and formed by using a lead 4 and a resin, and a covering portion 5 of a darker color than the resin molded body, which continuously covers the upper surface of the resin molded body and a part of the outer surface 2b in the height direction, and a light emitting element 40 mounted on the bottom of a recess, and in a boundary Br between the resin molded body 2 and the covering portion 5 on the outer surface of the package, an outer side surface central portion 2b2 is formed below an outer side surface corner portion 2b1.SELECTED DRAWING: Figure 1 【課題】製造コストを低減するパッケージの製造方法および発光装置の製造方法を提供する。【解決手段】発光装置１００は、上面視において多角形に形成され、上面に凹部３を有し、リード４と樹脂とを用いて形成される樹脂成形体２と、樹脂成形体の上面と外側面２ｂの高さ方向の一部とを連続して被覆する、樹脂成形体のよりも暗色の被覆部５と、を有するパッケージ３０と、凹部の底面に実装される発光素子４０と、を備え、パッケージの外側面における被覆部５と、樹脂成形体２との境界Ｂｒは、外側面角部２ｂ１よりも外側面中央部２ｂ２が下方に形成されている。【選択図】図１