SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

To provide a semiconductor device that can improve reliability, and a manufacturing method for the semiconductor device.SOLUTION: A semiconductor module 3 comprises: a module body 6; and a terminal projection part 31 that projects from the module body 6. A module bottom surface 61 facing a mounting...

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Main Authors TARUYA KIMIAKI, FUKU MASARU, BETSUSHIBA NORIYUKI, MURAMATSU YUYA, ISHII RYUICHI
Format Patent
LanguageEnglish
Japanese
Published 30.07.2020
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Summary:To provide a semiconductor device that can improve reliability, and a manufacturing method for the semiconductor device.SOLUTION: A semiconductor module 3 comprises: a module body 6; and a terminal projection part 31 that projects from the module body 6. A module bottom surface 61 facing a mounting surface 23 of a heat sink 2 is formed on the module body 6. An adhesion layer 4 is interposed between the module bottom surface 61 and the mounting surface 23. A protective member 5 is interposed between the module bottom surface 61 and the mounting surface 23 in an outside of the adhesion layer 4, and is interposed between the terminal projection part 31 and the mounting surface 23. And, the protective member is bonded to the module bottom surface 61, the mounting surface 23 and the adhesion layer 4.SELECTED DRAWING: Figure 1 【課題】信頼性の向上を図ることができる半導体装置、及び半導体装置の製造方法を得る。【解決手段】半導体モジュール3は、モジュール本体6と、モジュール本体6から突出する端子突出部31とを有している。モジュール本体6には、ヒートシンク2の実装面23に対向するモジュール底面61が形成されている。接着層4は、モジュール底面61と実装面23との間に介在している。保護部材5は、接着層4の外側でモジュール底面61と実装面23との間に介在しているとともに、端子突出部31と実装面23との間に介在している。また、保護部材は、モジュール底面61、実装面23及び接着層4に接着されている。【選択図】図1
Bibliography:Application Number: JP20190005879