SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT

• Main Authors: KAWANAKAKO HIROSHI, MUNAKATA OSAMU, TAKAHASHI HIROSHI, AKAGAWA TAKASHI, KAWASAKI HIROYOSHI, YOKOTA SATOSHI
• Format: Patent
• Language: English; Japanese
• Published: 27.07.2020
• Subjects: ALLOYS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

To provide a solder material with which viscosity increase due to the lapse of time is suppressed, and which is superior in wettability and reliability, and to provide a solder paste, and a solder joint.SOLUTION: A solder material contains an Sn or Sn-based alloy, 40-250 mass ppm of As, and 20 mass ppm-3 mass% of Bi, and includes an As-concentrated layer. The Sn or Sn-based alloy is an Sn-based alloy containing 0.005-40 mass% of Ag and/or 0.001-10% of Cu, and the solder material is provided in powder form.SELECTED DRAWING: Figure 1 【課題】本発明は、経時での粘度上昇が抑制され、濡れ性及び信頼性に優れるはんだ材料、ソルダペースト、及びはんだ継手を提供する。【解決手段】Ｓｎ又はＳｎ系合金、４０〜２５０質量ｐｐｍのＡｓ、及び２０質量ｐｐｍ〜３質量％のＢｉを含み、Ａｓ濃化層を有する、はんだ材料。Ｓｎ又はＳｎ系合金は、０．００５〜４０質量％のＡｇ及び又は０．００１〜１０％のＣｕを含むＳｎ系合金であり、はんだ材料の形態は粉末である。【選択図】図１