SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT

To provide a solder material with which viscosity increase due to the lapse of time is suppressed, and which is superior in wettability and reliability, and to provide a solder paste, and a solder joint.SOLUTION: A solder material contains an Sn or Sn-based alloy, 40-250 mass ppm of As, and 20 mass...

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Main Authors KAWANAKAKO HIROSHI, MUNAKATA OSAMU, TAKAHASHI HIROSHI, AKAGAWA TAKASHI, KAWASAKI HIROYOSHI, YOKOTA SATOSHI
Format Patent
LanguageEnglish
Japanese
Published 27.07.2020
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:To provide a solder material with which viscosity increase due to the lapse of time is suppressed, and which is superior in wettability and reliability, and to provide a solder paste, and a solder joint.SOLUTION: A solder material contains an Sn or Sn-based alloy, 40-250 mass ppm of As, and 20 mass ppm-3 mass% of Bi, and includes an As-concentrated layer. The Sn or Sn-based alloy is an Sn-based alloy containing 0.005-40 mass% of Ag and/or 0.001-10% of Cu, and the solder material is provided in powder form.SELECTED DRAWING: Figure 1 【課題】本発明は、経時での粘度上昇が抑制され、濡れ性及び信頼性に優れるはんだ材料、ソルダペースト、及びはんだ継手を提供する。【解決手段】Ｓｎ又はＳｎ系合金、４０〜２５０質量ｐｐｍのＡｓ、及び２０質量ｐｐｍ〜３質量％のＢｉを含み、Ａｓ濃化層を有する、はんだ材料。Ｓｎ又はＳｎ系合金は、０．００５〜４０質量％のＡｇ及び又は０．００１〜１０％のＣｕを含むＳｎ系合金であり、はんだ材料の形態は粉末である。【選択図】図１
Bibliography:Application Number: JP20200046654