RESIN COMPOSITION

• Main Author: WATANABE MASATOSHI
• Format: Patent
• Language: English; Japanese
• Published: 09.07.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition for forming a high dielectric constant insulating layer which inhibits the generation of aggregate of dielectric powder at a high level.SOLUTION: A resin composition comprises (A) epoxy resin, (B) dielectric powder, (C) nonionic surfactant, and (D) curing agent.SELECTED DRAWING: None 【課題】誘電体粉末の凝集物の生成が高いレベルで抑制された、高誘電率絶縁層形成用の樹脂組成物の提供。【解決手段】（Ａ）エポキシ樹脂、（Ｂ）誘電体粉末、（Ｃ）ノニオン性界面活性剤、及び（Ｄ）硬化剤を含有する樹脂組成物。【選択図】なし