METHOD FOR PRODUCING FOAMABLE POLYURETHANE RESIN MOLDED ARTICLE CONTAINING THERMALLY EXPANDABLE MICROCAPSULE BY REACTION INJECTION MOLDING METHOD

To provide a foamable polyurethane resin molded article having low density and excellent weather resistance, and to provide a method for producing the same.SOLUTION: A method for producing a foamable polyurethane resin molded article containing a thermally expandable microcapsule comprises a step of...

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Bibliographic Details
Main Authors SADO SHINICHIRO, SUZUKI MASARU, IDO HIROAKI
Format Patent
LanguageEnglish
Japanese
Published 09.07.2020
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Summary:To provide a foamable polyurethane resin molded article having low density and excellent weather resistance, and to provide a method for producing the same.SOLUTION: A method for producing a foamable polyurethane resin molded article containing a thermally expandable microcapsule comprises a step of producing a foamable polyurethane resin molded article from a polyol-containing component and a polyisocyanate-containing component by a reaction injection molding method, wherein at least one of the polyol-containing component and the polyisocyanate-containing component contains the thermally expandable microcapsule, wherein the content of the thermally expandable microcapsule is 0.5 to 7 parts by weight per 100 parts by weight of the total amount of the polyol-containing component and the polyisocyanate-containing component, and the thermally expandable microcapsule has the following features (A) and (B): (A) an average particle diameter before expansion of 5 to 70 μm; and (B) a foaming start temperature of 70 to 110°C.SELECTED DRAWING: None 【課題】低密度でありかつ優れた耐候性を備えた発泡性ポリウレタン樹脂成形品およびその製造方法を提供する。【解決手段】熱膨張性マイクロカプセルを含有する発泡性ポリウレタン樹脂成形品を製造する方法であって、ポリオール含有成分およびポリイソシアネート含有成分から反応射出成形法により発泡性ポリウレタン樹脂成形品を生成する工程を含んでなり、ポリオール含有成分および前記ポリイソシアネート含有成分の少なくとも一方が、前記熱膨張性マイクロカプセルを含有しており、熱膨張性マイクロカプセルの含有量が、前記ポリオール含有成分および前記ポリイソシアネート含有成分の合計量100重量部に対して0.5〜7重量部であり、かつ熱膨張性マイクロカプセルが、以下の(A)および(B)の特徴を有する、方法が提供される:(A)発泡前の平均粒子径5〜70μm(B)発泡開始温度70〜110℃。【選択図】なし
Bibliography:Application Number: JP20180243717