SUPPORTING METHOD OF DYE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE OR ELECTRONIC COMPONENT

To provide a new deposition method which can uniformly and suitably support dye on a substrate while significantly improving a support speed.SOLUTION: In a method of supporting dye on a substrate by contacting the dye with the substrate 14, the dye is contacted by immersing the substrate with a raw...

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Bibliographic Details
Main Authors SATO HIROYUKI, YAGYU SHINGO, IGAWA TAKUTO
Format Patent
LanguageEnglish
Japanese
Published 09.07.2020
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Summary:To provide a new deposition method which can uniformly and suitably support dye on a substrate while significantly improving a support speed.SOLUTION: In a method of supporting dye on a substrate by contacting the dye with the substrate 14, the dye is contacted by immersing the substrate with a raw material solution 18 containing the dye and an aprotic polar solvent (for example, dimethylformamide) under a reduced pressure (for example, 100-90000 Pa) to make the substrate support the dye.SELECTED DRAWING: Figure 2 【課題】担持速度を格段に向上させつつ、基体に対して色素を均一且つ良好に担持させることができる新規な成膜方法を提供する。【解決手段】色素を基体14に接触させることにより前記基体に前記色素を担持させる方法であって、前記接触を、減圧下(例えば、100Pa〜90000Pa)で前記色素と非プロトン性極性溶媒(例えば、ジメチルホルムアミド)とを含む原料溶液18に前記基体を含浸させることにより行って、色素を基体に担持させる。【選択図】図2
Bibliography:Application Number: JP20180248389