LIGHT-EMITTING DEVICE

To prevent a coating layer formed by ALD from cracking even when the coating layer is provided above or below an intermediate layer having a linear expansion coefficient different from the coating layer.SOLUTION: A coating layer 240 is a layer formed by atomic layer deposition (ALD) and includes an...

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Bibliographic Details
Main Author FUJIMORI JIRO
Format Patent
LanguageEnglish
Japanese
Published 02.07.2020
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Summary:To prevent a coating layer formed by ALD from cracking even when the coating layer is provided above or below an intermediate layer having a linear expansion coefficient different from the coating layer.SOLUTION: A coating layer 240 is a layer formed by atomic layer deposition (ALD) and includes an insulating inorganic material. An intermediate layer 220 includes a material having a coefficient of linear expansion different from that of the material of the coating layer 240. A buffer layer 230 has a surface in contact with the intermediate layer 220, that is, a first surface. The buffer layer 230 has a surface in contact with the coating layer 240, that is, a second surface. A difference in linear expansion coefficient between the material of the buffer layer 230 and the inorganic material of the coating layer 240 is smaller than a difference in linear expansion coefficient between the material of the intermediate layer 220 and the inorganic material of the coating layer 240.SELECTED DRAWING: Figure 5 【課題】ALDによって形成された被覆層をこの被覆層と異なる線膨張係数を有する中間層の上又は下に設けても、被覆層が割れることを防止する。【解決手段】被覆層240は、ALD(Atomic Layer Deposition)によって形成された層であり、絶縁性の無機材料を含んでいる。中間層220は、被覆層240の材料と異なる線膨張係数を有する材料を含んでいる。バッファ層230は、中間層220と接する面、すなわち第1面を有している。バッファ層230は、被覆層240と接する面、すなわち第2面を有している。バッファ層230の材料と被覆層240の無機材料の線膨張係数の差は、中間層220の材料と被覆層240の無機材料の線膨張係数の差より小さくなっている。【選択図】図5
Bibliography:Application Number: JP20200066011