SOLDER MATERIAL, SOLDER PASTE AND SOLDER JOINT

• Main Authors: KAWANAKAKO HIROSHI, MUNAKATA OSAMU, TAKAHASHI HIROSHI, AKAGAWA TAKASHI, KAWASAKI HIROYOSHI, YOKOTA SATOSHI
• Format: Patent
• Language: English; Japanese
• Published: 02.07.2020
• Subjects: ALLOYS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

To provide a solder material, a solder paste and a solder joint suppressing viscosity increase with time and being excellent in wettability and reliability.SOLUTION: A solder material has an As concentrated layer containing Sn or an Sn-based alloy, 40-250 mass ppm of As, 0-3,000 mass ppm of Sb, 0-10,000 mass ppm of Bi and 0-5,100 mass ppm of Pb (however, the contents of Bi and Pb do not become 0 mass ppm at the same time).SELECTED DRAWING: Figure 1 【課題】本発明は、経時での粘度上昇が抑制され、濡れ性及び信頼性に優れるはんだ材料、ソルダペースト、及びはんだ継手を提供することを目的とする。【解決手段】Ｓｎ又はＳｎ系合金、４０〜２５０質量ｐｐｍのＡｓ、０〜３０００質量ｐｐｍのＳｂ、０〜１００００質量ｐｐｍのＢｉ及び０〜５１００質量ｐｐｍのＰｂを含み（ただし、Ｂｉ及びＰｂの含有量が同時に０質量ｐｐｍになることはない）、Ａｓ濃化層を有する、はんだ材料。【選択図】図１