WOUND DRESSING ASSEMBLY
To provide a wound dressing assembly that incorporates both wound closure adhesive properties and sufficient exudate absorbing capacity.SOLUTION: A wound dressing assembly includes a wound cover and a carrier. The wound cover has a length and a width that are substantially greater than a height, a f...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
25.06.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a wound dressing assembly that incorporates both wound closure adhesive properties and sufficient exudate absorbing capacity.SOLUTION: A wound dressing assembly includes a wound cover and a carrier. The wound cover has a length and a width that are substantially greater than a height, a first major surface, and a second major surface. The first major surface has disposed thereon a wound cover pressure sensitive adhesive comprising a colloidal absorbent and arranged and configured to adhere to skin. The carrier has a length and a width that are substantially greater than a height, a first major surface, and a second major surface. The first major surface of the carrier is disposed in facing relation and removably attached to the second major surface of the wound cover, and has disposed thereon at least one pressure sensitive adhesive. After application of the wound cover to skin for use, the carrier is removable from the wound cover to leave the wound cover adhering to the skin. The pressure sensitive adhesive disposed on the first major surface of the carrier is configured as discontinuous patterns.SELECTED DRAWING: Figure 2
【課題】創傷閉鎖粘着特性と充分な滲出物吸収能力とを兼ね備えた創傷包帯アセンブリを提供する。【解決手段】創傷包帯アセンブリは、創傷被覆体と、支持体とを有する。創傷被覆体は、高さよりも大きい長さ及び幅と、第1の主面と、第2の主面と、を有する。第1の主面の上には、コロイド状吸収剤を含み皮膚に粘着するように配置及び構成されている創傷被覆体感圧接着剤が配置されている。支持体は、高さよりも大きい長さ及び幅と、第1の主面と、第2の主面と、を有する。支持体の第1の主面は、創傷被覆体の第2の主面と対向関係にあり、かつ第2の主面に剥離可能に付着され、その上に少なくとも1つの感圧接着剤が配置される。使用のために創傷被覆体を皮膚に適用した後、創傷被覆体が皮膚に粘着した状態で残置されるように支持体を創傷被覆体から剥がすことができる。支持体の第1の主面上に配置された感圧接着剤は、不連続パターンとして構成されている。【選択図】図2 |
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Bibliography: | Application Number: JP20200035601 |